Thermal Shock Chamber for common parts and molds
Our products are widely used in scientific research, aviation,electrical , electronic, toys, plastic , metal , batteries , cell phones, optical , LED, and other parts of the various industry sectors . In the company of talent , technology and funding various types of environmental testing equipment complies with GB, GJB, IEC, MIL, DIN and other standards for scientific research , electrical , electronics, aerospace, communications, automotive, laptop computers and other enterprises.
Objective: accelerated stress accelerated life test test test environmental stress screening (ESS)
1.Test method: temperature impact test temperature cycling test
2.Test environment: the environment more than the use of harsh environment limits
3.Sample:spare parts and components , solder joints (BGA, CSP) Finished
4.Sample size: small large
5.test temperature range : -40 (-55) ~ 125 (150) celsius degree , -40 (-65) ~ 125 (150) celsius degree , -40 (-0) ~ 100 celsius degree
6.Studio Size: the box size W*H*D600*850*800cm
Temperature change rate:
1.bath method : more than 30 celsius degree/min ( air )
2.bath method : more than 50 celsius degree/min ( air )
3.bath method : less than 15 celsius degree/min ( sample )
4.bath method : less than 20 celsius degree/min ( air )
1.100 ~ 500 times
2.accelerated test acceleration factor smaller than 10 to 20 times
3.Test result: production quality difference verify design information
Temperature Shock Test :
1.heating/cooling rate of not less than 30 celsius degree/min . Large temperature range , and also increases the test severity changes in the rate of temperature increase .
2.difference in temperature shock test and temperature cycling test is primarily different stress load mechanism . Mainly on the temperature shock test due to creep and fatigue damage cited
Lapse,but mainly on the temperature cycle fatigue failure due to shear caused .
3.temperature shock tests allow the use of two -slot test device ; temperature cycle test using a single-slot test device . In the second slot cabinets , temperature change rate to
Greater than 50 celsius degree/min.
4.temperature cycle test sample is exposed to a high temperature to set the alternate test environment.
5.To avoid temperature shocks,the rate of temperature change during the test must be less than 20 celsius degree/min .